Process Capabilities

PROCESS &TESTING CAPABILITIES

PROCESS CAPABILITIES

Process Capabilities_SMT

SMT

  • From 01005 chip to maximum 74mmX74mm Body Size Packages/modules
  • Maximum PCB size 610mm X560mm
  •  Plastic / Ceramic BGA / LGA Packages
  • Ultra-Fine 0.3mm Pitch Component Placement Capability
  • Placement accuracy 18 micron
  •  BGA Rework and Inspection Capability
  •  Rigid board & Flexible Printed Circuit board (FPC) Assembly Capability
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COB

  • Class 10K & 100K Class Clean-Room Manufacturing for Chip on Board (COB) Assembly.
Process Capabilities_Others

Others

  • Advance Manufacturing Process for Special PCB Assembly (metal back)
  • Conformal Coating
  • Epoxy Encapsulation
  • Clean / No –clean Process.
  • PCB Finishes: HASL, Immersion Tin/ Gold/ Silver, OSP
  • IPC-A-610 Class II & III Acceptance Standard.
  • Assembly in Accordance ISO13485, IATF 16949 requirement.