PRODUCTION FLOW
SURFACE MOUNT TECHNOLOGY
Layout for SMT lines is to cater for different lot sizes and complexities from a wide range of products. This enables flexibility to produce a range of products in both high and low volumes. Our SMT equipment is capable of fast and accurate paste-printing, pick-and-place, and reflow-soldering processes despite their various circuit board sizes. Quality control and output consistency of printed circuit board assembly (“PCBA”) are maintained by some highly sensitive measuring facilities, namely SPI machine, X-ray and Automated Optical Inspection (AOI) Equipment. The quality of the bare printed circuit board (“PCB”) is evaluated through a surface finished plating analysis instrument which inspects plating thickness error for defects before production. We are also capable of performing contamination analysis by utilizing ionic contamination testers.
